Nasze serwisy używają informacji zapisanych w plikach cookies. Korzystając z serwisu wyrażasz zgodę na używanie plików cookies zgodnie z aktualnymi ustawieniami przeglądarki, które możesz zmienić w dowolnej chwili. Więcej informacji odnośnie plików cookies.

Obowiązek informacyjny wynikający z Ustawy z dnia 16 listopada 2012 r. o zmianie ustawy – Prawo telekomunikacyjne oraz niektórych innych ustaw.

Wyłącz komunikat

 
 

Logowanie

Logowanie za pomocą Centralnej Usługi Uwierzytelniania PRz. Po zakończeniu pracy nie zapomnij zamknąć przeglądarki.

Elektrotechnika

Elektrotechnika
34(4/2015), DOI: 10.7862/re.2015.37

Comparison of different cooling systems using compact model

Adama Samake, Andrzej Kos

DOI: 10.7862/re.2015.37

Abstract

Due to the strong influence of temperature rising on integrated circuits performance and reliability, an adequate thermal analysis of their cooling systems is required during chip packaging in order to prevent the thermal catastrophe. In this paper, we propose an approach based on RC compact model, which enables in one hand an approximation of dynamic thermal behaviour and in other hand the accurate temperature computation at any measurement point of parallel plate fin heat sink with U-shape channels. Farther more, we present the impacts of convection coefficient on heat sink surface temperature using a simplified approach, which enables the temperature computation by using the RC thermal compact model. Due to the convection coefficient change of surrounding environment, the surfaces and mass of parallel plate fin heat sink with U-shape channels were reduced while enhancing heat transfer capability.

Full text (pdf)

References

[1] Dan C.: Radiative Heat transfer in Electronics, 2005.
[2] De Mey G. and Kos A.: Optimal temperature control of high frequency semiconductor structures cooled by Peltier heat pumps
[3] Frankiewicz M., Golda A., Kos A.: Investigation of Heat Transfer In Integrated Circuits, Metrology and Measurement Systems, vol.11, No.1, 2014, pp.111-120.
[4] Kos A. and De Mey G.: Thermal Modelling and optimization of power microcircuits, Electrochemical Publications LTD, ISBN 0901150 3603, England 1997.
[5] Kos A.: Accuracy of Temperature Computation in Hybrid Microelectronics Microelectronics International, vol.9, Iss: 1, 1992, pp.25-27.
[6] Mikula S. and Kos A.: Thermal Dynamics of Multicore Integrated systems, Components and Packaging Technologies, IEEE Transactions, Vol.33, No. 3, September 2010, pp.524-534.
[7] J.O'Loughlin J. and Loree D.: Cooling System Transient Analysis using an Electric Circuit Program Analog, Pulsed Power Conference, 2003. Digest of Technical Papers. PPC-2003. 14th IEEE International (Volume: 2), June 2003, pp 767 – 770.
[8] Rencz M., Székely V., and Poppe A.: A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards, IEEE transactions on components and packaging technologies, vol.30, No.30, September 2007, pp.367 – 374.
[9] Székely V. and Rencz M.: Thermal Dynamics and the time constant domain, IEEE transactions on components and packaging technologies, vol. 23, No.3, September 2000, pp.587 – 594.
[10] Székely V., Rencz M., P´ahi A. and Courtois B.: Thermal Monitoring and Testing of Electronic systems, IEEE Transactions on components and packaging technology, vol.22, No.2, June 1999, pp.231-237.
[11] Tockhorn A., Cornelius C., Saemrow H. and Timmermann D.: Modeling Temperature Distribution in Networks-on-Chip using RC-Circuits, Design and Diagnostics of Electronic Circuits and Systems (DDECS), 2010 IEEE 13th International Symposium on, April 2010, pp. 229 – 232.

About this Article

TITLE:
Comparison of different cooling systems using compact model

AUTHORS:
Adama Samake (1)
Andrzej Kos (2)

AUTHORS AFFILIATIONS:
(1) AGH University of Science and Technology, Faculty of Computer Science, Electronics and Telecommunications, Al. Mickiewicza 30, Krakow, Polan
(2) AGH University of Science and Technology, Faculty of Computer Science, Electronics and Telecommunications, Al. Mickiewicza 30, Krakow, Polan

JOURNAL:
Elektrotechnika
34(4/2015)

KEY WORDS AND PHRASES:
Thermal compact models, integrated circuit, heat sink, temperature, active cooling

FULL TEXT:
http://doi.prz.edu.pl/pl/pdf/elektrotechnika/64

DOI:
10.7862/re.2015.37

URL:
http://dx.doi.org/10.7862/re.2015.37

RECEIVED:
2015-11-03

COPYRIGHT:
Publishing House of Rzeszow University of Technology Powstańców Warszawy 12, 35-959 Rzeszow

POLITECHNIKA RZESZOWSKA im. Ignacego Łukasiewicza; al. Powstańców Warszawy 12, 35-959 Rzeszów
tel.: +48 17 865 11 00, fax.: +48 17 854 12 60
Administrator serwisu: